Feature :

* Apply to eMCP of Samsung , Sandisk , Toshiba , Hynix , Micron , HTC , MTK , Intel etc .

* Apply to BGA162/186 test

* eMCP data can be read and written fastly

* Accurate positioning on flat bottom pad and solder of eMCP

* Support flat bottom and solder ball testing .

* Technical support and datasheet are available if you need .

* we are the original manufacturer and welcome anyone to be our distribution agents

* Professional manufacturer in all kinds of IC chip testing sockets and adapters.

 More Quantities with  LOWER PRICE!

* More types of sockets and adapters for eMMC , eMCP , SOP , SSOP , TSSOP , QFP , QFN , BGA , SOT , MSOP , DFN and customize design , for customized socket and more product detail , please feel free to contact us .  

Specification and Dimension :

* Type : Test & Burn in Socket ( to DIP48 )

* Package : eMCP162 ,eMCP186 , BGA162 , BGA186

* Pin Pitch : 0.5 mm

* Pin Count : 17 pins

* Applicable IC body size : 12x16 mm ,we also provide size 11.5x13mm for this adapter , please see more product in our store .

* eMCP thickness : 0.8mm - 1.5mm

Package Including :

1 * eMCP162/186 to DIP48 adapter

1 * border limiter 12x16mm

Shipping :

* Shipped within 5 days

* It will take 7-15 days to arrive at your American Address ( Not the Amazon Standard Shipping for 17-28 business days 

• Type : Test & Burn in Socket ( To DIP48 )
• Package : eMCP162 eMCP186 BGA162 BGA186
• Pin Pitch : 0.5 mm , Pin Count : 17 pins , eMCP thickness : 0.8mm - 1.5mm
• Applicable IC body size : 12x16 mm , we also provide other size 11.5x13 for this adapter , please see more products in our store .
• More types of sockets and adapters for eMMC , eMCP , SOP , SSOP , TSSOP , QFP , QFN , BGA , SOT , MSOP , DFN and customize design , for customized socket and more product detail , please feel free to contact us .

Type : Test & Burn in Socket ( To DIP48 )KZT